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Transcend Announces its Hi-Speed, High Capacity 1GB DDR2-533 Micro-DIMM Memory Module for Notebook Computers

Nov 29, 2006
Transcend Information, Inc. is proud to announce the release of its 1GB Hi-Speed DDR2-533 Micro-DIMM Memory Module for Notebooks that use Intel's Centrino Duo platform. The 1GB DDR2-533 Micro-DIMM Module is designed, so that it is only 65 per cent the size of a regular SO-DIMM (Small Outline DIMM) commonly used in notebooks, but has the same memory capacity. The introduction of this higher capacity 1GB module will further accelerate the manufacture of lighter and smaller Notebooks such as, LG's T1 Express Dual, which has enhanced functionality and longer battery life.

Transcend's Micro-DIMMs use the latest 214-pin "mezzanine connector" technology, which reduces the size of the module by approximately 40 percent when compared with an SO-DIMM. Transcend's 256MB to 1GB DDR2-533 Micro-DIMMs improve performance considerably and increase your system's overall stability. All of Transcend's DDR2-533 memory modules follow the standard developed by JEDEC (the Joint Electron Device Engineering Council), the memory industry's standards organization. Using a Transcend DDR2 Micro-DIMM module in your Notebook will provide you with significant benefits, including lower power consumption, which can improve battery life and help achieve better overall performance.

Transcend's memory modules are built to the highest specifications with the best chips and materials. All our modules undergo rigorous laboratory testing to ensure they provide the highest performance and reliability. Transcend's memory modules are recognized for their higher quality, outstanding performance, excellent compatibility, and superb reliability and stability. Trust in the best and achieve the most from your systems by choosing a Transcend memory module.

Product Features
  • Hi-Speed, High Capacity 1GB DDR2-533 Micro-DIMM Memory Module
  • 1.8 V Operating Voltage, reducing power consumption by around 50 percent compared with DDR
  • On-Die Termination (ODT) technology to minimize memory signal reflections at higher speeds
  • FBGA chip packages for improved electrical and heat dissipation characteristics
  • Excellent compatibility and reliability
  • Lifetime Warranty

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