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Transcend Releases its High-Capacity Low Profile 2GB DDR400 ECC Registered Memory Module (1.2 inches)

Mar 15, 2006
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Transcend Information, Inc. proudly announces the release of its new, low profile 2GB DDR400 ECC Registered Memory Module (P/N: TS256MDR72V4L). Specially designed and engineered, the new 2GB DDR400 ECC Registered Memory Module measures only 1.2 inches in height, so it can be used in any server, or workstation. The Transcend 2GB DDR400 ECC Registered Memory Module is particularly suited to high-end computing systems, such as the IBM eSERVER 326, IBM IntelliStation A Pro, HP ProLiant series (DL 385, BL 25p, BL 35p) and Sun's Java W series.

Transcend's 2GB DDR400 ECC Registered memory module consists of 128Mx4 brand name original DDR FBGA chips. The six-layer PCB used for Transcend's 2GB modules are designed to meet the highest specifications by minimizing noise signal disturbance and enhancing overall performance. Transcend's superior design results in better system stability and reliability, our 2GB DDR400 ECC Registered memory module is the best choice of memory module for high-end servers and workstations. Transcend's 2GB DDR400 ECC Registered memory chips are packed in Fine-Pitch Ball Grid Array (FBGA) chip packages for improved electrical and heat dissipation characteristics.

Transcend memory modules are built to the highest specifications with the best chips and materials, they undergo rigorous laboratory testing to ensure they provide the highest performance and reliability. All Transcend memory modules come with a lifetime warranty and a global service network, which provides a cost-effective solution that ensures the highest stability and reliability for your computing systems. Transcend memory modules are recognized for their high quality, outstanding performance, excellent compatibility, and superb reliability and stability. Trust in the best and achieve the most from your systems by choosing Transcend memory modules.


Product Features
  • Low Profile DDR400 ECC Registered Memory 1.2-inch
  • Excellent compatibility and reliability
  • FBGA chip packages for improved electrical and heat dissipation characteristics
  • Six-layer PCB
  • LifeTime Warranty


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